Isimiso sokucabanga se-Detector

Abakwa-Thermal Infrared Storictors ikakhulukazi basebenzisa imisebe ye-infrared ukukhiqiza izinguquko zokushisa emtshina, amandla okugoba, amandla, amanje, amavolumu nezinye izinhlobo ezibonakalayo, ngokuya ngezinguquko ezibonakalayo zingahlukanisa imininingwane yethagethi yento.

Izithonjana ze-Photon azidingi ukukhanya - Inqubo yokuguqulwa kwe-thermal, ngenxa yomthelela we-photoeleelctric, into ebucayi ibamba ama-photons, ukuxhumana ngokuqondile ngama-elektroni, akhiqiza ngqo amasiginali kagesi.

Uhlobo lomtshina - Insimbi engenalutho?
I-Metal Housing + ingilazi noma i-lens window

Izinzuzo
1. I-High Heat Dissipation: Iphakethe lensimbi liqhuba ukushisa ngokushesha, lilungele ama-Medium / High Amandla Okufanekisela Imicabango Emanzi Wezithombe.
2. Ukuvikelwa kwe-electromagnetic: Izindlu zensimbi zinganciphisa ukuphazamiseka kwe-electromagnetic yangaphandle (i-EMI) futhi zithuthukise ukuqina kwesiginali.
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4. Ukuqina kwegesi okuhle: kungagcwaliswa ngogesi we-inert (njenge-nitrogen) ukuvikela i-oxidation futhi kunwebe impilo yomtshina.

Okubi
1. Isisindo esikhulu: inqwaba yensimbi ephezulu, ayihambelani nemishini ephathekayo engasindi.
2. Izindleko eziphakeme: Ukulungiswa kwensimbi yensimbi, izingxenye zensimbi eziyigugu, okwandisa izindleko zokukhiqiza.

Uhlobo lomtshina - Ceramic ongaxhunyiwe?
Ikhava yensimbi ye-Ceramic + Metal

Izinzuzo
1. Ukumelana nokushisa okuphezulu / kokugqwala: ubumba (e.g. Al?o?, ALN) kungamelana namazinga okushisa aphezulu angama-500 ° C noma ngaphezulu, okwenza balungele izindawo ezingeqile ezifana nama-aerospace namandla enuzi.
2. Ukumelana okushisayo okuphansi: ubumba - ubumba obufana ne-aluminium nitride (ALN) banokuvuselelwa okushisayo eduze kwezinsimbi, futhi babe nokudilizwa okungcono kakhulu kokushisa.

Okubi
1. I-Brittleness ephezulu: Kulula ukuphula, ubunzima obuphezulu ekusebenzeni kwemishini.
2. Izindleko eziphakeme: Intengo ye-Ceramic yephakheji ye-Ceramic iphakeme kunepulasitiki, kepha iphansi kunephakethe le-hermetic hermetic.

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Uhlobo lomtshina - Ama-wafers angenalutho?
Ukupakishwa kwenziwe ngqo ku-wafer?

Izinzuzo?
I-Ultra - I-miniaturization: Ukupakishwa kwenziwa ngqo ku-wafer ngosayizi omncane?
Ukuhlanganiswa: Iyahambisana nenqubo ye-CMOS.
Izindleko eziphansi (ivolumu ephezulu): I-Wafer - I-Level Batch Processing, izindleko eziphansi kakhulu iyunithi ngayinye

Okubi?
Ukubekezelelwa kwezemvelo okungalungile: Imvamisa akulona - i-airtight, wesaba umswakama nothuli.
Ukudicilela phansi okubuthakathaka: kuncike ku-silicon - Kususelwa ekushiseni ukushisa okusekelwe, kungangezelela ezindaweni eziphakeme zamandla.
Izinselelo Zokuthembela: Ukukhathala okuxazulula ukukhathala kalula ngaphansi kokuhamba ngebhayisikile, impilo ephansi kunamaphakheji wensimbi / ceramic.

Uhlobo lomtshina - Ukupholisa okujwayelekile


Abatholi abajwayelekile abapholile:?
Uhlobo lomtshina: I-Mercury Cadmium Orluride (MCT / HGCDTE)?
Qala - Isikhathi se-Up: ≤8min?
Izinga lohlaka: Kufika ku-100hz?
Isikhathi sokwehluleka: ≥6000h


Uhlobo lomtshina - Ukupholisa okushisayo?


Ukuthola Ukupholisa Okushisayo:?
Uhlobo lomtshina: I-Class II Ultra Latta?
Amandla ngesikhathi: ≤3min?
Isilinganiso sohlaka: 50 / 30hz?
Kusho isikhathi sokwehluleka: ≥20000h